Ingredient: Sn42Bi58                                      Melting point: 138℃

Usage: LED strip beads, as well as some paper PCBs or other special soldering that cannot withstand high temperatures.

Ingredient: Sn64.7Bi35Ag0.3                          Melting point: 183℃
Usage: Mobile phone repair, tail plug welding, BGA soldering, chip level maintenance, etc

Ingredient: Sn99Ag0.3Cu0.7                           Melting point: 217℃
Usage: Used for products with certain SMT processes or high temperature resistance

Flux:Lead free and halogen-free, with no resistance value, suitable for mobile phone repair, precision component repair, etc

Please note when using:

You use a hot air gun or soldering iron for heating, and the temperature needs to be higher than the melting point of the product, because there will be heat loss during the heating process. You need to let the solder paste melt quickly, so that the welding effect will be better

If you have any problems during use, you can contact the customer service of the store and we will solve them for you